If the CHIPS Act doesn't happen, Intel's plan seems to be to focus on countries outside of the US where the company is getting subsidies, although the Ohio fab is still likely to be built, just at a slower pace. That said, Intel also issued a statement saying "the scope and pace of our expansion in Ohio will depend heavily on funding from the CHIPS Act.", which was also part of the initial press release back in January when the fab plans were announced. However, the Register was told that the planned construction start date remains unchanged, for now. It will apparently still be held at some point, but the Intel spokesperson had no answer when questioned if the ceremony was contingent on the CHIPS Act.
![c program that converts xps to pdf c program that converts xps to pdf](https://d136c6g36wumfk.cloudfront.net/p/5717/b42affd8cfe65c394dad7b16eb169dbb.png)
In an official response from Intel to the Register, the company said that the event hasn't been rescheduled, which the publications says means that there's no new date planned for the groundbreaking ceremony. Intel allegedly sent out an email to various state and federal lawmakers that it has placed the ceremony on hold, indefinitely due to the lack of progress on the CHIPS Act. As such, the company is said to have put the brakes on the groundbreaking ceremony for its planned Ohio fab, which was meant to take place on the 22nd of July. The US Congress hasn't been able to agree on passing what is known as the CHIPS Act, which consists of some US$52 billion in subsidies for semiconductor manufacturers and it appears that Intel isn't very pleased. Overall this looks like a pretty kitted out board without too much excessive bling and will hopefully be priced accordingly. Finally audio is via a Realtek ALC4082 USB connected audio codec and an ESS Sabre 9218 DAC.
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ASRock has gone for an Intel Killer E3100G 2.5 Gbps Ethernet controller and an Intel Killer AX1675X WiFi 6E and Bluetooth card, with the combo having Killer DoubleShot Pro support.
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Furthermore the board has five rear USB 3.2 Gen 2 (10 Gbps) USB-A ports around the back, plus three USB 3.2 Gen 1 (5 Gbps) ports and a further four via headers, as well as a single HDMI port of unknown version. The board also has eight SATA ports, two Thunderbolt 4 ports, which apparently are USB4 certified as well and a header for a USB 3.2 Gen 2x2 (20 Gbps) case mounted port. In addition to this there are four M.2 slots, where ASRock has decided to call the CPU connected slot for Blazing, as it's PCIe 5.0, whereas the three PCIe 4.0 slots are using the Hyper name the company has used so far. The board has a pair of PCIe 5.0 x16 slots that operate in dual x8 mode when both slots are used. For starters, ASRock has gone for a 26-phase SPS Dr.MOS power design, which should be plenty even for the most avid overclocker.
![c program that converts xps to pdf c program that converts xps to pdf](https://d136c6g36wumfk.cloudfront.net/p/5717/3e3393e251a0d589370d67f3bcf3a678.png)
However, we now get a few more details with regards to what to expect in terms of additional features. The page still has very limited information and there's only a single picture of the motherboard, which is the same one that the company shared at Computex.
![c program that converts xps to pdf c program that converts xps to pdf](https://www.freeviewer.org/img/xps/converter/3.png)
It would appear that we're slowly getting closer to the launch of AMD's AM5 platform, as ASRock just put up its first X670E motherboard on its website.